TANIGUROGUMI CORPORATION

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 489
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 3153
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 2360

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9686871 Soldering device, soldering method, and substrate and electronic component produced by the soldering device or the soldering methodMar 20, 14Jun 20, 17[B23K, H05K]
9289841 Soldering device, soldering method, and substrate and electronic component produced by the soldering device or the soldering methodApr 16, 12Mar 22, 16[H01L, B23K, H05K]
9149883 Soldering device, soldering method, and substrate and electronic component produced by the soldering device or the soldering methodApr 14, 12Oct 06, 15[B23K, H05K]
8138576 Production method and production apparatus of tin or solder alloy for electronic components, and solder alloyApr 13, 09Mar 20, 12[H01L]
8011562 Soldering equipment and soldering method for electronic componentsAug 29, 09Sep 06, 11[B23K]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2015/0115,020 SOLDER BUMP, METHOD FOR FORMING A SOLDER BUMP, SUBSTRATE PROVIDED WITH SOLDER BUMP, AND METHOD FOR MANUFACTURING SUBSTRATEAbandonedApr 17, 12Apr 30, 15[B23K, H05K]
2014/0036,427 COMPONENT HAVING AN ELECTRODE CORROSION PREVENTING LAYER AND A METHOD FOR MANUFACTURING THE COMPONENTAbandonedAug 02, 12Feb 06, 14[B23K]

Top Inventors for This Owner

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